Products & Services

Printed Circuit Board Types:

Rigid Flex
Rigid
Flex
Single and Double Sided
Multi-Layer
Back Plane Controlled Impedance
Metal Core Boards

Materials used per IPC-4101:

Teflon – GF – GI
Other Exotic Materials

Services:

Assembly:
Through Hole
Surface Mounted
Small to Medium Run Capability
Military and Aerospace Applications
Turn Key & Consignment

Contact Us

In-house Capabilities:

Artwork & Tooling
CAD Engineering
Interlayer Process & Lamination
Drilling / Blind & Buried Vias
AOI (Inner Layer Inspection)
Plasma Etch Back
Electroless Copper Plating
Outer Layer Print
Electrolytic Copper Plate
Etch & Strip
LPI Mask
(Liquid Photo Imageable Solder)
Legend (Nomenclature)
HASL (Hot Air Solder Level)
Final Routing
Electrical Test
(Flying Probe & Bed of Nails)
Inspection Quality Audit
Heatsink Bonding

Valley Syncom Circuits

VSC