Printed Circuit Board Types:
Rigid Flex
Rigid
Flex
Single and Double Sided
Multi-Layer
Back Plane Controlled Impedance
Metal Core Boards
Materials used per IPC-4101:
Teflon – GF – GI
Other Exotic Materials
Services:
Assembly:
Through Hole
Surface Mounted
Small to Medium Run Capability
Military and Aerospace Applications
Turn Key & Consignment
In-house Capabilities:
Artwork & Tooling
CAD Engineering
Interlayer Process & Lamination
Drilling / Blind & Buried Vias
AOI (Inner Layer Inspection)
Plasma Etch Back
Electroless Copper Plating
Outer Layer Print
Electrolytic Copper Plate
Etch & Strip
LPI Mask
(Liquid Photo Imageable Solder)
Legend (Nomenclature)
HASL (Hot Air Solder Level)
Final Routing
Electrical Test
(Flying Probe & Bed of Nails)
Inspection Quality Audit
Heatsink Bonding
